ADG609BNZ

DIP16，ADG609BNZ, 3 V/5 V, 4/8 Channel, Analog Multiplexer, +0.3 V to –6.5 V

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Price:: US $1.30~1.80 / piece [Get Latest Price]

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	US $1.30~1.80

PartNumber:: ADG609BNZ

Brand:: Analog Devices - ADI | Pack: DIP | D/C: 07+

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Products Upload time: 2011-12-08

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Part Number:ADG609BNZ
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Product Summary

The ADG609BNZ is a monolithic CMOS analog multiplexer comprising eight single channels and four differential channels respectively, fully specified for ±5 V, +5 V and +3 V power supply. The ADG609BNZ switch is one of eight inputs to a common output as determined by the 3-bit binary address lines A0, A1 and A2. The ADG609BNZ switch one of four differential input to a common differential output as determined by the 2-bit binary address lines A0 and A1. An EN input on both devices is used to enable or disable the device. When disabled, all channels are switched OFF. All the address and enable inputs of the ADG609BNZ are TTL compatible over the full specified operating temperature range, making the parts suitable for bus-controlled systems such as data acquisition systems, process controls, avionics and ATEs since the TTL compatible address inputs simplify the digital interface design and reduce the board space requirements.

Parametrics

ADG609BNZ absolute maximum ratings: (1)VDD to VSS: +13 V; (2)VDD to GND: –0.3 V to +6.5 V; (3)VSS to GND: +0.3 V to –6.5 V; (4)Analog, Digital Inputs2: –0.3 V to VDD + 2 V; (5)or 20 mA, Whichever Occurs First; (6)Continuous Current, S or D: 20 mA; (7)Peak Current, S or D; (8)(Pulsed at 1 ms, 10% Duty Cycle Max): 40 mA; (9)Operating Temperature Range Industrial (B Version): –40℃ to +85℃; (10)Extended (T Version): –55℃ to +125℃; (11)Storage Temperature Range: –65℃ to +150℃; (12)Junction Temperature: +150℃; (13)Plastic DIP Package qJA, Thermal Impedance: 117℃/W; (14)Lead Temperature, Soldering (10 sec): +260℃.

Features

ADG609BNZ features: (1)+3 V, +5 V, 65 V Power Supplies; (2)VSS to VDD Analog Signal Range; (3)Low On Resistance (30 V max); (4)Fast Switching Times; (5)tON 75 ns max; (6)tOFF 45 ns max; (7)Low Power Dissipation (1.5 mW max); (8)Break-Before-Make Construction; (9)ESD > 5000 V as per Military Standard 3015.7; (10)TTL and CMOS Compatible Inputs.